NXP Semiconductors Taiwan Ltd. — 14 prefixes (MA-L); Kaohsiung back-end packaging/test subsidiary, not a distinct device brand

NXP Semiconductors Taiwan Ltd. holds 14 IEEE MA-L blocks, all registered to the same entity at No. 10, Jing 5th Rd., Nanzi Dist., Kaohsiung City 811643, Taiwan — a wholly-owned back-end (assembly/packaging/final-test) subsidiary of NXP Semiconductors N.V. (Eindhoven, Netherlands). The address sits inside the Nanzih (Nanzi) Export Processing Zone, established 1968, where NXP is one of the anchor semiconductor packaging/test tenants alongside ASE Group and Orient Semiconductor Electronics; the zone's IC packaging/testing operations account for the large majority of its production value. NXP's own TS16949 (automotive quality) certificate names the Kaohsiung site, and an NXP corporate sustainability post describes on-site mold-scrap recycling (~120 tons/year) — both consistent with a back-end IC packaging/test operation rather than a design or wafer-fab site. Trade-data aggregators show the site exporting finished ICs, with Vietnam and the Philippines among its top destination markets. This is the same organizational pattern already documented for NXP's Tianjin subsidiary: a regional assembly/test node manufacturing NXP's networking-capable silicon (i.MX application processors, Kinetis/MCX MCUs, connectivity/NFC chips) under the parent company's global back-end network — the OUI identifies NXP silicon, not a finished-device brand. No Kaohsiung/Taiwan-site-specific security incidents were found; parent-level NXP silicon has documented issues (e.g., CVE-2023-39902 in U-Boot SPL on i.MX 8M, and third-party research on i.MX High Assurance Boot secure-boot bypasses), none tied specifically to this facility.

IEEE assignment

14 prefixes → "NXP Semiconductors Taiwan Ltd.", registered Nanzi Dist., Kaohsiung City 811643, Taiwan [Confirmed] — the IEEE MA-L registry

Registry / block size

MA-L only; 14 blocks (~234.9M addresses); prefix list cross-checked against maclookup.app and matches exactly (0C:51:41, 10:CB:33, 10:ED:C8, 14:4F:F0, 1C:04:60, 24:1F:49, 34:E1:D7, 38:B9:AF, 44:D4:65, 68:5E:DF, 94:0E:2A, D0:B6:46, D0:EA:30, FC:8F:A4)

[Confirmed] — the IEEE MA-L registry, https://maclookup.app/vendors/nxp-semiconductors-taiwan-ltd

HQ / country

No. 10, Jing 5th Rd., Nanzi Dist., Kaohsiung City 811643, Taiwan, inside the Nanzih Export Processing Zone [Confirmed] — IEEE MA-L; https://www.bip.gov.tw/english/page.aspx?pageid=53960b98a33f336b

Parent company

Wholly-owned subsidiary of NXP Semiconductors N.V. (Eindhoven, Netherlands) [Confirmed] — nxp.com; https://www.dnb.com/business-directory/company-profiles.nxp_semiconductors_taiwan_ltd.a3bfad53623d6019f3b6e06ad374462e.html

Company status

active; real, independently-corroborated legal entity — D&B company profile, Kompass Taiwan directory listing, Glassdoor office listing, NXP-published TS16949 quality certificate naming the Kaohsiung site, and Trademo trade-data records of IC exports (Vietnam, Philippines top markets)

[Confirmed] — dnb.com, tw.kompass.com, glassdoor.com, nxp.com TS16949 PDF, trademo.com

Facility role

back-end IC packaging and final test (not wafer fab or primary design); anchor tenant of the Nanzih EPZ alongside ASE Group and Orient Semiconductor Electronics; on-site mold-scrap recycling program (~120 t/yr) consistent with molding/packaging operations

[Confirmed] — bip.gov.tw, nxp.com sustainability blog (BL-MGZN-RECYCLING-MOLD-SCRAP)

Device types

NXP's networking-capable silicon lines assembled/tested across NXP's global back-end network (of which Kaohsiung is one node) — i.MX application processors (Ethernet-capable), Kinetis/MCX MCUs, wireless connectivity (BLE/802.15.4/NFC) — same "silicon, not finished-device brand" pattern as NXP's other back-end sites [Confirmed, by analogy to documented NXP Tianjin facility] — /mac/vendor/nxp-semiconductor-tianjin/, nxp.com

Security context

no Kaohsiung/Taiwan-site-specific incidents found; parent-level NXP silicon has documented issues — CVE-2023-39902 (U-Boot Secondary Program Loader authentication bypass affecting select i.MX 8M processors) and third-party research (Quarkslab, NCC Group) on i.MX High Assurance Boot (HAB) secure-boot bypasses — none of these are specific to the Taiwan facility, which is an assembly/test site, not a design center

[Confirmed] — nvd.nist.gov/vuln/detail/CVE-2023-39902, community.nxp.com, blog.quarkslab.com, nccgroup.com

Vendor website

https://www.nxp.com/ (parent; no separate Taiwan-subsidiary microsite found) [Confirmed] — nxp.com

IEEE assignment dates

none published for any of the 14 blocks in the IEEE registry file; third-party tool maclookup.app shows scraped "date registered" values (earliest 2023-11-27, most recent update 2026-05-26) for this org — these are database-scrape artifacts of when the third party's copy last saw a change, NOT IEEE assignment facts, and must not be published as IEEE registration dates

[Confirmed] — the IEEE MA-L registry (no date column), maclookup.app

Related vendors

NXP Semiconductor (Tianjin) LTD. (sibling back-end subsidiary, already DONE), NXP Semiconductors N.V. (parent), Freescale Semiconductor / Philips Semiconductors (corporate lineage) [Confirmed] — /mac/vendor/nxp-semiconductor-tianjin/, /mac/vendor/nxp/

Analyst note

an NXP-Taiwan OUI on a globally-administered address identifies silicon assembled/tested at NXP's Kaohsiung back-end site — it flags NXP chip content, not a finished-device brand, since many such chips ship inside third-party modules or end products.