AMPAK Technology — 42 prefixes (MA-L)

AMPAK Technology, Inc. is a Taiwanese OEM founded in 2000 (Hsinchu, Taiwan) that designs compact Wi-Fi, Bluetooth, and GNSS combo modules rather than finished consumer products — so an AMPAK OUI almost always identifies an embedded wireless module that some other brand soldered into its device, not an AMPAK-branded gadget. The IEEE footprint is 42 MA-L blocks, all registered to "AMPAK Technology" (three of the newest as "AMPAK Technology Inc."), with no MA-M (the IEEE MA-M registry) or MA-S (the IEEE MA-S registry) entries for the name. The registry addresses trace a relocation history: early blocks list 3F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou; a mid-period cluster lists No.1 Jen Ai Road in the same park; the three most recent blocks (54-96-CB, 24-36-72, B0-F5-C8) list 6F., No.23, Huanke 1st Rd., Zhubei City, Hsinchu County; and one outlier (00-22-F4) lists a Jhongli/Taoyuan address. AMPAK's well-known AP6xxx-series modules (e.g. AP6181, AP6212, AP6255, AP6256, AP6330, AP6356) are built mostly around Broadcom BCM chipsets and turn up in Android phones/tablets, smart-home and IoT gear, IP cameras, media boxes, POS terminals, and single-board computers (Banana Pi, Orange Pi, Khadas). Two analyst points: a device carrying an AMPAK MAC is almost certainly an IoT appliance, consumer-electronics product, or embedded-Linux SBC — useful for inventory fingerprinting — and because the PCIe variants are often driven directly, the same modules frequently surface under Broadcom OUIs (14:E4 family) instead of an AMPAK-registered prefix, so absence of an AMPAK OUI does not rule the module out.

IEEE assignment

42 prefixes → AMPAK Technology, Inc. (Hsinchu / Hsinchu County, Taiwan, R.O.C.); all MA-L blocks [Confirmed] — IEEE MA-L

Registry / block size

MA-L only (24-bit OUI); 42 blocks counted from cached the IEEE MA-L registry. No MA-M (the IEEE MA-M registry) or MA-S (the IEEE MA-S registry) entries for "AMPAK Technology" [Confirmed] — IEEE MA-L. NOTE: IEEE's public OUI data publishes NO assignment/registration date (the IEEE MA-L registry columns are only Registry, Assignment, Organization Name, Organization Address); any "date registered" on third-party tools is a database artifact, not an IEEE fact.

HQ / country

Taiwan (R.O.C.). Registry addresses vary by block: early — 3F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu 30352; mid-period — No.1, Jen Ai Road, Hsinchu Industrial Park, Hukou, Hsinchu 30352; newest (54-96-CB, 24-36-72, B0-F5-C8) — 6F., No.23, Huanke 1st Rd., Zhubei City, Hsinchu County 302047; one outlier (00-22-F4) — No. 8-1, Nanyuan 2nd Rd., Jhongli, Taoyuan 320

[Confirmed] — IEEE MA-L

Company status

active; OEM wireless-module supplier [Confirmed] — ampak.com.tw/about/about-ampak

Founding year

2000 (company fact, not a MAC/OUI date) [Confirmed] — ampak.com.tw/about/about-ampak

Device types

Wi-Fi / Bluetooth / GNSS / cellular combo modules embedded by OEMs into Android phones and tablets, smart-home and IoT devices, IP cameras, smart TVs and media/streaming boxes, single-board computers (Banana Pi, Orange Pi, Khadas), HDMI sticks, handheld gaming devices, POS terminals, and industrial/healthcare IoT. AMPAK supplies modules, not finished end-user devices

[Confirmed] — ampak.com.tw/about/about-ampak, deviwiki.com/wiki/AMPAK, stellastra.com/what-is-ampak-technology-on-my-wifi

Notable products

AP6xxx-series Wi-Fi+BT combo modules — AP6181, AP6201, AP6210, AP6212/A, AP6232F, AP6255, AP6256, AP6330, AP6335, AP6356, AP6359SA, AP6441, AP6452, AP6474 (SDIO/M.2/LGA); WSDB-720GN and WUBB-743GN USB Wi-Fi dongles. Primary chipset partner is Broadcom (BCM series); some older USB modules used Ralink

[Confirmed] — deviwiki.com/wiki/AMPAK

Verified prefix sample (all MA-L, AMPAK Technology)

00:2D:B3, 00:22:F4, 10:D0:7A, 6C:FA:A7, 54:96:CB, 24:36:72 [Confirmed] — IEEE MA-L

Registration date

Unknown — IEEE publishes no OUI assignment/registration date; third-party "date registered" fields for MAC prefixes are database artifacts, not IEEE facts. No first-party IEEE date source exists [Confirmed that IEEE publishes none] — standards-oui.ieee.org/oui/oui.csv

IANA reference

Not applicable — OUI entries carry no IANA RFC reference (column stays blank) [Confirmed] — standards-oui.ieee.org/oui/oui.csv

Security context

no CVEs specific to AMPAK modules were found in this research pass; AMPAK is a legitimate Taiwanese OEM module supplier, so an AMPAK MAC indicates an embedded wireless module in a consumer/IoT device, not an intrusion. Standard IoT hygiene applies (firmware updates, WPA2/WPA3, IoT network segmentation) [Confirmed no AMPAK-specific CVE found this pass] — stellastra.com/what-is-ampak-technology-on-my-wifi, learnlatesttech.com/what-is-suspicious-ampak-technology-on-wi-fi

Cross-vendor caveat

because the PCIe variants of these modules are often driven directly, AMPAK modules frequently surface under Broadcom OUIs (14:E4 family) rather than an AMPAK-registered prefix [Likely — community/wiki sourced] — deviwiki.com/wiki/AMPAK

Related vendors

Broadcom (primary chipset supplier); modules integrated by many downstream device brands

Analyst note

A device showing an AMPAK MAC is almost certainly an IoT appliance, consumer-electronics product, or embedded-Linux single-board computer — useful for device fingerprinting/inventory — not a PC or phone running a standard desktop OS stack. Absence of an AMPAK OUI does not rule the module out, since the same silicon can present a Broadcom prefix.